Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor

An adhesive film for circuit connection, comprising:

• a first adhesive layer comprising conductive particles, a cured product of a photocurable resin component comprising a radical polymerizable compound and a photo radical polymerization initiator, and a first thermosetting resin component comprising a cationic polymerizable compound and a thermal cationic polymerization initiator;
• and
• a second adhesive layer provided on the first adhesive layer and comprising a second thermosetting resin component comprising a cationic polymerizable compound and a thermal cationic polymerization initiator, wherein
• a thickness of the first adhesive layer is 5 μm or less,
• the cationic polymerizable compound comprises both an oxetane compound and an alicyclic epoxy compound, and
• in the first adhesive layer, a content of the cured product of the photocurable resin component is 10% to 30% by mass, and a content of the first thermosetting resin component is 20% to 40% by mass, based on a total mass of the first adhesive layer.