H05K 2201/0187
With regions of different dielectrics in the same layer
Official title: with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
H05K2201/0187 (With regions of different dielectrics in the same layer) appears on 732 US grants and 769 published applications in this corpus.
Search patents in H05K- Granted patents
- 732
- Published applications
- 769
- Assignees
- 323
- Inventors
- 1,556
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 11 | 0 |
| 1991 | 11 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 6 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 12 | 0 |
| 1999 | 11 | 0 |
| 2000 | 13 | 0 |
| 2001 | 8 | 6 |
| 2002 | 16 | 21 |
| 2003 | 20 | 16 |
| 2004 | 24 | 36 |
| 2005 | 16 | 28 |
| 2006 | 22 | 38 |
| 2007 | 17 | 45 |
| 2008 | 27 | 46 |
| 2009 | 20 | 60 |
| 2010 | 31 | 45 |
| 2011 | 38 | 31 |
| 2012 | 36 | 34 |
| 2013 | 36 | 24 |
| 2014 | 29 | 44 |
| 2015 | 38 | 32 |
| 2016 | 27 | 34 |
| 2017 | 37 | 39 |
| 2018 | 25 | 33 |
| 2019 | 33 | 25 |
| 2020 | 32 | 29 |
| 2021 | 21 | 27 |
| 2022 | 15 | 15 |
| 2023 | 17 | 23 |
| 2024 | 13 | 16 |
| 2025 | 13 | 10 |
| 2026 | 12 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate25 Aug 2026US 12,720,669 B2Murata Manufacturing Co., Ltd.
- Multilayer substrate including insulating layers, signal conductive layers and ground layers and having through holes extending along intersecting directions18 Aug 2026US 12,712,246 B2Murata Manufacturing Co., Ltd.
- Electrical component and method of forming same4 Aug 2026US 12,701,657 B2Medtronic, Inc.
- Wiring board structure21 Jul 2026US 12,690,141 B2Unimicron Technology Corp.
- Balancing loss across all ports on printed circuit board traces9 Jun 2026US 12,652,753 B2Cisco Technology, Inc.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Printed circuit board and preparation method thereof, and electronic communication device20 Aug 2026US 2026/0247524 A1Huawei Technologies Co., Ltd.
- Deformable article20 Aug 2026US 2026/0247526 A1Sendance GmbH
- Circuit board structure and manufacturing method thereof23 Jul 2026US 2026/0214790 A1Unimicron Technology Corp.
- Circuit board structure and manufacturing method thereof23 Jul 2026US 2026/0214791 A1Unimicron Technology Corp.
Most cited
By later US patents
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Selective plating method for forming integral via and wiring layers210US 5,209,817 AInternational Business Machines Corporation · 1993
- Dielectric waveguide with non-planar interface surface and mating deformable material182US 9,350,063 B2Texas Instruments Incorporated · 2016
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993
- Voltage tunable laminated dielectric materials for microwave applications171US 6,377,142 B1Paratek Microwave, Inc. · 2002