US 2026/0214790 A1 · CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

Abstract

A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a first circuit pattern, a second circuit pattern, a first cover layer, and a dielectric layer. The first circuit pattern is disposed on the substrate and has a first circuit density. The second circuit pattern is disposed on the substrate and has a second circuit density, wherein the second circuit density is greater than the first circuit density. The first cover layer is disposed on the substrate and covers the first circuit pattern. The dielectric layer includes a first portion and a second portion. The first portion covers and is in contact with the upper surface of the first cover layer, and the second portion covers the second circuit pattern.

Claims20

Dependent claims

A circuit board structure, comprising:

a substrate;
a first circuit pattern disposed on the substrate, wherein the first circuit pattern has a first circuit density;
a second circuit pattern disposed on the substrate, wherein the second circuit pattern has a second circuit density, and the second circuit density is greater than the first circuit density;
a first cover layer disposed on the substrate and covering the first circuit pattern;
and
a dielectric layer, comprising:
a first portion covering and in contact with an upper surface of the first cover layer;
and
a second portion covering the second circuit pattern.

6 more elements

A manufacturing method of a circuit board structure, comprising:

forming a first circuit pattern on a substrate, wherein the first circuit pattern has a first circuit density;
forming a second circuit pattern on the substrate, wherein the second circuit pattern has a second circuit density, and the second circuit density is greater than the first circuit density;
forming a first cover layer on the first circuit pattern, wherein the first cover layer covers the first circuit pattern;
and
forming a dielectric layer on the first cover layer and the second circuit pattern.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

19/446,208Filed 12 Jan 2026

Priority

17 Jan 2025

Published

23 Jul 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

H05K 1/0296
Details: conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
H05K 3/4655
Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern: by using a laminate characterized by the insulating layer
H05K 1/0298
Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295: multilayer circuits
H05K 3/4644
Manufacturing multilayer circuits: by building the multilayer layer by layer, i.e. build-up multilayer circuits

Circuit board structure and manufacturing method thereof

Life of this patent

Circuit board structure and manufacturing method thereof

Life of this patent

Abstract

Claims20