H05K 2201/0191
Wherein the thickness of the dielectric plays an important role
Official title: wherein the thickness of the dielectric plays an important role
H05K2201/0191 (Wherein the thickness of the dielectric plays an important role) appears on 423 US grants and 469 published applications in this corpus.
Search patents in H05K- Granted patents
- 423
- Published applications
- 469
- Assignees
- 260
- Inventors
- 1,083
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 8 | 3 |
| 2002 | 16 | 14 |
| 2003 | 7 | 11 |
| 2004 | 14 | 14 |
| 2005 | 5 | 15 |
| 2006 | 9 | 13 |
| 2007 | 6 | 23 |
| 2008 | 17 | 25 |
| 2009 | 12 | 34 |
| 2010 | 11 | 27 |
| 2011 | 20 | 16 |
| 2012 | 15 | 16 |
| 2013 | 16 | 17 |
| 2014 | 23 | 25 |
| 2015 | 23 | 29 |
| 2016 | 23 | 19 |
| 2017 | 14 | 15 |
| 2018 | 12 | 16 |
| 2019 | 20 | 25 |
| 2020 | 16 | 19 |
| 2021 | 17 | 18 |
| 2022 | 13 | 18 |
| 2023 | 16 | 27 |
| 2024 | 21 | 15 |
| 2025 | 12 | 7 |
| 2026 | 8 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof14 Jul 2026US 12,684,704 B2Sanmina Corporation
- Wiring circuit board26 May 2026US 12,641,719 B2Nitto Denko Corporation
- Circuit board26 May 2026US 12,641,720 B2LG Innotek Co., Ltd.
- Circuit board19 May 2026US 12,635,067 B2LG Innotek Co., Ltd.
- Copper base substrate comprising an insulating layer having a specific relationship between thickness and elastic modulus21 Apr 2026US 12,610,463 B2Mitsubishi Materials Corporation
- Higher current surface mount pads and circuit assembly24 Sep 2026US 2026/0292979 A1
- Electronic Smoking Device Comprising a Rigidised Flexible PCB9 Jul 2026US 2026/0191260 A1JT International SA
- Substrate structure2 Jul 2026US 2026/0190227 A1Unimicron Technology Corp.
- Semiconductor package2 Jul 2026US 2026/0191054 A1Samsung Electronics Co., Ltd.
- Electronic device comprising a single dielectric layer for solder mask and cavity and method for fabricating the same25 Jun 2026US 2026/0182422 A1Qorvo US, Inc.
Most cited
By later US patents
- Method for making flexible circuit card with laser-contoured vias and machined capacitors109US 5,066,357 AHewlett-Packard Company · 1991
- Multi-layered interconnect structure using liquid crystalline polymer dielectric96US 7,301,108 B2International Business Machines Corporation · 2007
- Moldable/foldable radio housing86US 4,939,792 AMotorola, Inc. · 1990
- Rigid flex printed circuit configuration86US 5,004,639 ASheldahl, Inc. · 1991
- Multi-layered printed wiring board84US 6,075,211 ANEC Corporation · 2000