Substrate structure

Abstract

A substrate structure includes a base and at least one build-up structure layer. The base includes a dielectric core plate and at least one first conductive through hole penetrating the dielectric core plate. The at least one build-up structure layer is disposed on the base and includes a dielectric layer and at least one second conductive through hole penetrating the dielectric layer. A coefficient of thermal expansion of the dielectric layer is less than a coefficient of thermal expansion of the dielectric core plate. The at least one second conductive through hole is electrically connected to the at least one first conductive through hole.

Dependencies are inferred from the claim text.