Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof
AssigneeSanmina Corporation
InventorsShinichi Iketani, Toshiya Suzuki
Life of this patent
Estimating the term…
Abstract
Ultra-thin dielectric printed circuit boards (PCBs) are provided. An ultra-thin dielectric layer may be coupled to a first conductive layer on a first side of the ultra-thin dielectric layer. A second conductive layer may be coupled to a second side of the ultra-thin dielectric layer, and the ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may be patterned to form electrical paths. The patterned second conductive layer may be filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may also be coupled to the second conductive layer.
Claims9
An ultra-thin dielectric printed circuit board (PCB), comprising:
- a first conductive layer comprising a first side and a second side opposite the first side, the first conductive layer detachably coupled on the first side to a disposable base by an adhesive layer between and in direct contact with the first side of the first conductive layer and the disposable base, the adhesive layer facilitating detachment of the disposable base by peeling the disposable base from the first conductive layer;
- a patterned second conductive layer comprising a first side and a second side opposite the first side;
- a first ultra-thin dielectric layer coupled to the second side of the first conductive layer and to the first side of the second conductive layer, where the first ultra-thin dielectric layer is positioned between and in direct contact with the second side of the first conductive layer and the first side of the second conductive layer across the entirety of second side of the first conductive layer and the entirety of the first side of the second conductive layer, and a portion of the first ultra-thin dielectric layer that is positioned between the second side of the first conductive layer and the first side of the second conductive layer is thinner than the first conductive layer between the first side and the second side of the first conductive layer and thinner than the second conductive layer between the first side and the second side of the second conductive layer;
- a dielectric filler filling the patterned second conductive layer;
- a third conductive layer comprising a first side and a second side opposite the first side, the third conductive layer detachably coupled on the first side to the disposable base on a side of the disposable base opposite from the first conductive layer, the third conductive layer coupled to the disposable base by another adhesive layer between and in direct contact with the first side of the third conductive layer and the disposable base, the other adhesive layer facilitating detachment of the disposable base by peeling the disposable base from the third conductive layer;
- a patterned fourth conductive layer comprising a first side and a second side opposite the first side;
- and
- a second ultra-thin dielectric layer coupled to the second side of the third conductive layer and to the first side of the fourth conductive layer, where the second ultra-thin dielectric layer is positioned between and in direct contact with the second side of the third conductive layer and the first side of the fourth conductive layer across the entirety of second side of the third conductive layer and the entirety of the first side of the fourth conductive layer.
Dependencies are inferred from the claim text.