Higher current surface mount pads and circuit assembly

Abstract

A circuit assembly includes a first circuit substrate and at least at first surface mount pad. The first surface mount pad may be disposed on a first surface of the first circuit substrate, where the first surface mount pad includes a base surface mount pad and a supplemental conductive element fabricated on the base surface mount pad such that the base surface mount pad is disposed between the first circuit substrate and the supplemental conductive element such as fabricated from metal. The first circuit substrate may further include a second surface mount pad. The height of the first surface mount pad may be greater than the height of the second surface mount pad. The high-profile height of the first surface mount pad supports a higher current throughput than the low-profile height second surface mount pad.

Dependencies are inferred from the claim text.