Wiring circuit board
AssigneeNitto Denko Corporation
InventorsRihito Fukushima, Shusaku Shibata, Teppei Niino
Life of this patent
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Abstract
A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.
Claims8
A wiring circuit board comprising:
- a first insulating layer,
- a conductive pattern disposed on the first insulating layer and having a first terminal, a second terminal, and a wiring electrically connecting the first terminal and the second terminal, the wiring having a first portion disposed away from the first terminal, the first portion being larger than the first terminal in a plan view, and a second portion disposed between the first terminal and the first portion, and
- a second insulating layer disposed on the first insulating layer and covering the wiring,
- wherein
- the second insulating layer covers the entire first portion;
- the conductive pattern has
- a first conductive layer disposed on the first insulating layer and
- a second conductive layer disposed on the first conductive layer;
- the first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer;
- and
- the second portion of the wiring consists of the first conductive layer or the second conductive layer.
A wiring circuit board comprising:
- a first insulating layer;
- a conductive pattern disposed on the first insulating layer, having a first terminal, a second terminal, and a wiring electrically connecting the first terminal and the second terminal, the wiring having a first portion disposed away from the first terminal, the first portion being larger than the first terminal in a plan view, and a second portion disposed between the first terminal and the first portion, and the conductive pattern having a first conductive layer disposed on the first insulating layer and a second conductive layer disposed on the first conductive layer;
- an intermediate insulating layer disposed between the first conductive layer and the second conductive layer;
- and
- a second insulating layer disposed on the first insulating layer and covering the wiring,
- wherein
- the second insulating layer covers the entire first portion;
- the first terminal includes a portion consisting of the first conductive layer, the second conductive layer, and the intermediate insulating layer;
- the first portion of the wiring includes a portion consisting of the first conductive layer and the second conductive layer;
- and
- the second portion of the wiring consists of at least one of the first conductive layer and the second conductive layer.
Dependencies are inferred from the claim text.