US 12,641,720 B2 · Circuit board

Abstract

A circuit board according to an embodiment includes an insulating layer including first to third regions; an outer circuit pattern disposed on upper surfaces of the first to third regions of the insulating layer, and a solder resist including a first part disposed on the first region of the insulating layer, a second part disposed on the second region, and a third part disposed on the third region, wherein the outer circuit pattern includes a first trace disposed on an upper surface of the first region of the insulating layer; a first pad disposed on an upper surface of the first region of the insulating layer; and a second trace disposed on an upper surface of the third region of the insulating layer; wherein an upper surface of the first part of the solder resist is positioned lower than an upper surface of the first trace; and a height of the first trace is different from a height of the first pad.

Claims20

Dependent claims

A circuit board comprising:

a build-up insulating layer including a plurality of insulating layers stacked along a vertical direction;
an outer circuit pattern disposed on the build-up insulating layer;
and
a protective layer disposed on the build-up insulating layer,
wherein the protective layer includes a first part and a second part having a thickness greater than that of the first part,
wherein the outer circuit pattern includes a first pad and a first trace penetrating the first part of the protective layer,
wherein the first pad and the first trace have different thicknesses,
wherein the thickness of the first pad is smaller than the thickness of the first part of the protective layer, and
wherein the first pad does not overlap the protective layer in the vertical direction.

6 more elements

Dependencies are inferred from the claim text.

Circuit board

Life of this patent

Circuit board

Life of this patent

Abstract

Claims20