Circuit board

An antenna substrate comprising:

• a substrate;
• an uppermost conductive pattern layer disposed on the substrate;
• a first solder resist layer disposed on the uppermost conductive pattern layer;
• and
• a second solder resist layer disposed on the first solder resist layer,
• wherein the first solder resist layer includes a material different from a material of the second solder resist layer,
• wherein the first solder resist layer includes a first region disposed on the substrate and not overlapping the uppermost conductive pattern layer in a vertical direction, and a second region disposed on the uppermost conductive pattern layer and having a thickness smaller than a thickness of the first region,
• wherein a thickness of the second solder resist layer is greater than the thickness of the first region of the first solder resist layer,
• wherein the second solder resist layer does not contact the uppermost conductive pattern layer and is spaced apart from the uppermost conductive pattern layer by the thickness of the second region in the vertical direction,
• wherein the uppermost conductive pattern layer includes a plurality of conductive patterns spaced apart from each other in a horizontal direction,
• wherein the second solder resist layer includes a plurality of insulating patterns overlapping each of the plurality of conductive patterns in the vertical direction and spaced apart from each other in the horizontal direction, and
• wherein a width of each of the plurality of insulating patterns in the horizontal direction is greater than a width of each of the plurality of conductive patterns in the horizontal direction.