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OwnerKazuya NARITOMI, Takayuki ICHIMURA +1inventors
InventorsKazuya NARITOMI, Takayuki ICHIMURA, Tomoharu YAMAZAKI
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A method for producing a circuit connection structure includes a step of interposing an adhesive film for circuit connection containing conductive particles between a first circuit member having a first electrode and a second circuit member having a second electrode, and thermocompression-bonding the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other. The adhesive film for circuit connection has a first adhesive layer containing conductive particles and a first thermosetting resin component, and a second adhesive layer disposed on the first adhesive layer and containing a second thermosetting resin component. The second thermosetting resin component includes a cationically polymerizable compound, a thermal cationic polymerization initiator, and a cation stabilizer that reacts with a cation species generated by thermal decomposition of the thermal cationic polymerization initiator.
A method for producing a circuit connection structure, the method comprising a step of interposing an adhesive film for circuit connection containing conductive particles between a first circuit member having a first electrode and a second circuit member having a second electrode, and thermocompression-bonding the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other,
An adhesive film for circuit connection, the adhesive film comprising a first adhesive layer comprising conductive particles and a first thermosetting resin component, and a second adhesive layer disposed on the first adhesive layer, the second adhesive layer comprising a second thermosetting resin component,
Dependencies are inferred from the claim text.