Printed circuit board

A printed circuit board comprising:

• a substrate portion including a first insulating layer, and a first wiring layer disposed on or in the first insulating layer;
• and
• a connection structure disposed on or in the substrate portion, and including a plurality of first dielectric layers, first and second metal layers respectively disposed on the plurality of first dielectric layers, a second insulating layer disposed on the plurality of first dielectric layers, and a second wiring layer disposed on the second insulating layer,
• wherein each of the plurality of first dielectric layers includes an organic material,
• a distance between the first metal layer and the second metal layer is less than a distance between the first metal layer and the second wiring layer,
• the first metal layer includes a first metal plate, and a first connection pad spaced apart from the first metal plate, and
• the second metal layer includes a second metal plate.