H05K 2201/0195
Dielectric or adhesive layers comprising a plurality of layers
Official title: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
H05K2201/0195 (Dielectric or adhesive layers comprising a plurality of layers) appears on 1,062 US grants and 1,089 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,062
- Published applications
- 1,089
- Assignees
- 455
- Inventors
- 2,569
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 9 | 0 |
| 1989 | 9 | 0 |
| 1990 | 11 | 0 |
| 1991 | 13 | 0 |
| 1992 | 18 | 0 |
| 1993 | 11 | 0 |
| 1994 | 17 | 0 |
| 1995 | 15 | 0 |
| 1996 | 16 | 0 |
| 1997 | 15 | 0 |
| 1998 | 19 | 0 |
| 1999 | 17 | 0 |
| 2000 | 15 | 0 |
| 2001 | 30 | 17 |
| 2002 | 23 | 42 |
| 2003 | 38 | 40 |
| 2004 | 39 | 47 |
| 2005 | 30 | 42 |
| 2006 | 25 | 32 |
| 2007 | 20 | 41 |
| 2008 | 19 | 43 |
| 2009 | 24 | 52 |
| 2010 | 26 | 57 |
| 2011 | 24 | 37 |
| 2012 | 43 | 33 |
| 2013 | 29 | 29 |
| 2014 | 32 | 44 |
| 2015 | 34 | 66 |
| 2016 | 33 | 42 |
| 2017 | 45 | 36 |
| 2018 | 35 | 49 |
| 2019 | 40 | 52 |
| 2020 | 57 | 61 |
| 2021 | 39 | 53 |
| 2022 | 35 | 52 |
| 2023 | 44 | 47 |
| 2024 | 46 | 33 |
| 2025 | 31 | 17 |
| 2026 | 12 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Printed circuit board18 Aug 2026US 12,713,531 B2Samsung Electro-Mechanics Co., Ltd.
- Magnetic ceramic substrate, substrate manufacturing method, and circulator11 Aug 2026US 12,707,561 B2Mitsubishi Electric Corporation
- Circuit board and semiconductor package comprising same28 Jul 2026US 12,696,390 B2LG Innotek Co., Ltd.
- Crosstalk noise reduction by high permeability insulator2 Jun 2026US 12,648,458 B2International Business Machines Corporation
- Method for manufacturing circuit connection structure, adhesive film for circuit connection, and circuit connection structure24 Sep 2026US 2026/0292990 A1
- Flexible circuit board and electronic device10 Sep 2026US 2026/0271179 A1Huawei Technologies Co., Ltd.
- Circuit board and manufacturing method thereof27 Aug 2026US 2026/0255475 A1Avary Holding (Shenzhen) Co., Limited.
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239535 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Systems and methods for high-stiffness substrate integration in semiconductor packages16 Jul 2026US 2026/0206130 A1Avago Technologies International Sales Pte. Limited
Most cited
By later US patents
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices266US 6,326,698 B1Micron Technology, Inc. · 2001
- Method of forming a three-dimensional printed circuit assembly211US 5,264,061 AMotorola, Inc. · 1993
- Dielectric waveguide with non-planar interface surface and mating deformable material182US 9,350,063 B2Texas Instruments Incorporated · 2016
- Multilayer printed-circuit board and semiconductor device174US 6,534,723 B1Ibiden Co., Ltd. · 2003