Multilayer printed-circuit board and semiconductor device

A multilayer printed-circuit board formed by stacking on each other:

• a plurality of single-sided circuit boards, each including a hard insulative substrate having at least one conductor circuit formed on one side thereof, and a plurality of via-holes each comprising a hole formed through the hard insulative substrate extending to the at least one conductor circuit, and each filled with a conductive substance;
• and
• a single-sided circuit board including a hard insulative substrate having at least one conductor circuit formed on one side thereof, and at least one through-hole formed through the hard insulative substrate extending to the at least one conductor circuit;
• and
• applying an adhesive between the single-sided circuit boards, and heating and pressing the single-sided circuit boards together forming stacked circuit boards having two outermost circuit boards;
• one of the outermost circuit boards having formed on the surface thereof at least one conductive bump positioned right above a via-hole and electrically connected to the via-hole;
• and
• the other outermost circuit board having formed on the surface thereof at least one conductive pin or ball positioned right above a via-hole and electrically connected to the via-hole;
• and
• a distance between neighboring via-holes formed in each of the circuit boards increases from one circuit board to another.

A semiconductor device including a multilayer printed-circuit board formed by stacking a plurality of circuit boards on each other, each of said plurality of circuits boards including a hard insulative substrate comprising two sides, and at least one conductor circuit formed on at least one of said two sides, a plurality of via-holes each comprising a hole formed through the hard insulative substrate extending to the at least one conductor circuit, and each filled with an electro-plating substance, and including at least one projecting conductor electrically connected to the via-hole;

• applying an adhesive between the plurality of circuit boards, and heating and pressing the circuit boards together forming stacked circuit boards having two outermost circuit boards, and electrically connecting at least one electronic component to one of said two outermost circuit boards of the multilayer printed-circuit board;
• one of the outermost circuit boards having formed on the surface thereof at least one conductive bump positioned right above a via-hole and electrically connected to the via-hole, and the electronic component being electrically connected to the at least one conductive bump;
• the other outermost circuit board opposite to the outermost circuit board on which the electronic component is mounted including on the surface thereof at least one chip capacitor electrically connected to the via-hole positioned beneath the electronic component;
• and
• a distance between neighboring via-holes formed in each of the circuit boards increases from one circuit board to another.

A multilayer printed-circuit board formed by stacking a plurality of circuit boards on each other, each of said plurality of circuit boards including a hard insulative substrate comprising two sides, and at least one conductor circuit formed on at least one of said two sides, and a plurality of via-holes each comprising a hole formed through the hard insulative substrate extending to the at least one conductor circuit, and each filled with a conductive substance;

• applying an adhesive between the plurality of circuit boards, and heating and pressing the plurality of circuit boards together forming stacked circuit boards having two outermost circuit boards;
• one of the outermost circuit boards having formed on the surface thereof at least one conductive bump positioned right above a via-hole and electrically connected to the via-hole;
• the other outermost circuit board having formed on the surface thereof at least one conductive pin or ball positioned right above a via-hole and electrically connected to the via-hole;
• and
• a density with which the via-holes are formed in each said stacked circuit boards being smaller from the one of the outermost circuit boards on which an electronic component is to be mounted towards the other outermost circuit board adapted to be connected to a mother board.

A multilayer printed-circuit board formed by stacking on each other:

• a plurality of single-sided circuit boards, each including a hard insulative substrate having at least one conductor circuit formed on one side thereof, and-a plurality of via-holes each comprising a hole formed through the hard insulative substrate extending to the at least one conductor circuit, and each filled with a conductive substance;
• and
• a single-sided circuit board including a hard insulative substrate having at least one conductor circuit formed on one side thereof, and at least one through-hole formed through the hard insulative substrate extending to the at least one conductor circuit;
• and
• applying an adhesive between the single-sided circuit boards, and heating and pressing the single-sided circuit boards together forming stacked circuit boards having two outermost circuit boards;
• one of the outermost circuit boards having formed on the surface thereof at least one conductive bump positioned right above a via-hole and electrically connected to the via-hole;
• and
• the other outermost circuit board having formed on the surface thereof at least one conductive pin or ball positioned right above a via-hole and electrically connected to the via-hole;
• and
• a density with which the via-holes are formed in each said stacked circuit boards being smaller from the one of the outermost circuit boards on which an electronic component is to be mounted towards the other outermost circuit board adapted to be connected to a mother board.

A semiconductor device including a multilayer printed-circuit board formed by stacking a plurality of circuit boards one each other, each of said plurality of circuits boards including a hard insulative substrate comprising two sides, and at least one conductor circuit formed on at least one of said two sides, a plurality of via-holes each comprising a hole formed through the hard insulative substrate extending to the at least one conductor circuit, and each filled with an electro-plating substance, and including at least one projecting conductor electrically connected to the at least one via-hole;

• applying an adhesive between the plurality of circuit boards, and heating and pressing the circuit boards together forming stacked circuit boards having two outermost circuit boards, and electrically connecting at least one electronic component to one of said two outermost circuit boards of the multilayer printed-circuit board,
• one of the outermost circuit boards having formed on the surface thereof at least one conductive bump positioned right above a via-hole and electrically connected to the via-hole, and the electronic component being electrically connected to the at least one conductive bump;
• the other outermost circuit board opposite to the outermost circuit board on which the electronic component is mounted having on the surface thereof at least one chip capacitor electrically connected to the via-hole positioned beneath the electronic component;
• and
• a density with which the via-holes are formed in each said stacked circuit boards being smaller from the one of the outermost circuit boards on which an electronic component is to be mounted towards the other outermost circuit board adapted to be connected to a mother board.