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US 12,696,390 B2Granted
Circuit board and semiconductor package comprising same
AssigneeLG Innotek Co., Ltd.
InventorsYong Suk Kim, Bo Ra Kang, Jeong Han Kim
Life of this patent
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Abstract
A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, the coating layer includes a first functional group, and the first insulating layer includes a reactive group bonded to the first functional group.
Claims20
A circuit board comprising:
- a first insulating layer including a through hole passing through an upper surface and a lower surface opposite to the upper surface;
- a coating layer disposed on an inner wall of the through hole of the first insulating layer;
- and
- a through electrode disposed to fill the through hole on the coating layer,
- wherein the through electrode includes:
- a first metal layer disposed on the coating layer;
- and
- a second metal layer disposed on the first metal layer,
- wherein the coating layer includes a first functional group, and
- wherein the first insulating layer includes a reactive group bonded to the first functional group.
7 more elements
A semiconductor package comprising:
- an insulating layer having a through hole passing through an upper surface and a lower surface opposite to the upper surface;
- a coating layer including a first portion disposed on an upper surface of the insulating layer and a second portion on an inner wall of the through hole of the insulating layer;
- and
- a circuit pattern layer disposed on the first portion of the coating layer;
- and
- a through electrode disposed on the second portion of the coating layer to fill the through hole,
- wherein the circuit pattern layer and the through electrode include:
- a first metal layer disposed on the first or second portion of the coating layer;
- and
- a second metal layer disposed on the first metal layer,
- wherein the coating layer includes a first functional group, and
- wherein the insulating layer includes a reactive group bonded to the first functional group.
9 more elements
Dependencies are inferred from the claim text.