H05K 2201/04
Assemblies of printed circuits
H05K2201/04 (Assemblies of printed circuits) appears on 2,846 US grants and 3,212 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,846
- Published applications
- 3,212
- Assignees
- 1,236
- Inventors
- 6,805
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 7 | 0 |
| 1986 | 6 | 0 |
| 1987 | 8 | 0 |
| 1988 | 11 | 0 |
| 1989 | 16 | 0 |
| 1990 | 20 | 0 |
| 1991 | 13 | 0 |
| 1992 | 18 | 0 |
| 1993 | 15 | 0 |
| 1994 | 22 | 0 |
| 1995 | 18 | 0 |
| 1996 | 30 | 0 |
| 1997 | 11 | 0 |
| 1998 | 25 | 0 |
| 1999 | 22 | 0 |
| 2000 | 31 | 0 |
| 2001 | 35 | 13 |
| 2002 | 54 | 50 |
| 2003 | 37 | 55 |
| 2004 | 50 | 60 |
| 2005 | 43 | 62 |
| 2006 | 49 | 82 |
| 2007 | 43 | 96 |
| 2008 | 56 | 105 |
| 2009 | 56 | 116 |
| 2010 | 83 | 96 |
| 2011 | 86 | 78 |
| 2012 | 78 | 65 |
| 2013 | 70 | 89 |
| 2014 | 55 | 118 |
| 2015 | 85 | 145 |
| 2016 | 95 | 112 |
| 2017 | 130 | 155 |
| 2018 | 138 | 182 |
| 2019 | 192 | 197 |
| 2020 | 186 | 212 |
| 2021 | 207 | 208 |
| 2022 | 163 | 193 |
| 2023 | 152 | 177 |
| 2024 | 142 | 202 |
| 2025 | 173 | 139 |
| 2026 | 83 | 205 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/042Stacked spaced pcbsIndexing code1,085
- H05K 2201/049Pcb for one componentIndexing code572
- H05K 2201/041Stacked pcbs, i.e. having neither an empty space nor mounted components inIndexing code425
- H05K 2201/044Details of backplane or midplane for mounting orthogonal pcbsIndexing code369
- H05K 2201/048Second pcb mounted on first pcb by inserting in window or holesIndexing code217
- H05K 2201/045Hierarchy auxiliary pcb, i.e. more than two levels of hierarchy for daughterIndexing code126
- H05K 2201/047Box-like arrangements of pcbsIndexing code110
- H05K 2201/046Planar parts of folded pcbs making an angle relative to each otherIndexing code86
Recent patents
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Sensor node thermal management and illumination18 Aug 2026US 12,710,318 B2Dwellwell Analytics, Inc.
- EMC filter device having an integrated current sensor and an integrated capacitor; and power electronics module18 Aug 2026US 12,712,514 B2Schaeffler Technologies AG & Co. KG
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Pcb stack element8 Oct 2026US 2026/0313801 A1Harting, S.A.
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Adhesive and method for manufacturing circuit connection structure8 Oct 2026US 2026/0313803 A1
- Board-to-board stacking arrangement1 Oct 2026US 2026/0304626 A1Aivres Systems Inc.
Most cited
By later US patents
- Stacked semiconductor device323US 7,049,692 B2Fujitsu Limited · 2006
- Electronic device interconnection techniques286US 5,477,933 AAT&T Corp. · 1995
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000
- Flexible printed circuit sensor assembly for detecting optical pulses256US 5,390,670 AGould Electronics Inc. · 1995
- Robotic surgical system with local sensing of functional parameters based on measurements of multiple physical inputs249US 11,376,082 B2Cilag GmbH International · 2022