H05K 2201/042
Stacked spaced pcbs
Official title: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
H05K2201/042 (Stacked spaced pcbs) appears on 1,085 US grants and 1,429 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,085
- Published applications
- 1,429
- Assignees
- 610
- Inventors
- 2,938
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 6 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 2 | 1 |
| 2003 | 2 | 1 |
| 2004 | 3 | 8 |
| 2005 | 7 | 7 |
| 2006 | 3 | 6 |
| 2007 | 5 | 12 |
| 2008 | 5 | 27 |
| 2009 | 10 | 33 |
| 2010 | 18 | 30 |
| 2011 | 19 | 24 |
| 2012 | 31 | 27 |
| 2013 | 28 | 34 |
| 2014 | 21 | 46 |
| 2015 | 34 | 68 |
| 2016 | 38 | 49 |
| 2017 | 50 | 60 |
| 2018 | 61 | 87 |
| 2019 | 95 | 105 |
| 2020 | 94 | 114 |
| 2021 | 103 | 111 |
| 2022 | 90 | 109 |
| 2023 | 79 | 97 |
| 2024 | 77 | 125 |
| 2025 | 107 | 76 |
| 2026 | 59 | 170 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Sensor node thermal management and illumination18 Aug 2026US 12,710,318 B2Dwellwell Analytics, Inc.
- EMC filter device having an integrated current sensor and an integrated capacitor; and power electronics module18 Aug 2026US 12,712,514 B2Schaeffler Technologies AG & Co. KG
- Field device and method for compact arrangement of electronic assemblies of an electronic circuit18 Aug 2026US 12,713,532 B2VEGA Grieshaber KG
- Pcb stack element8 Oct 2026US 2026/0313801 A1Harting, S.A.
- Board-to-board stacking arrangement1 Oct 2026US 2026/0304626 A1Aivres Systems Inc.
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Switching power supply module17 Sep 2026US 2026/0282234 A1Murata Manufacturing Co., Ltd.
- Circuit board assembly for a drive unit of an electric bicycle, and mounting method10 Sep 2026US 2026/0264806 A1Brose Antriebstechnik GmbH & Co. Kommanditgesellschaft, Berlin
Most cited
By later US patents
- Flexible printed circuit sensor assembly for detecting optical pulses256US 5,390,670 AGould Electronics Inc. · 1995
- Foldable electronic assembly module210US 5,224,023 A1993
- Method of making a flexible printed circuit sensor assembly for detecting optical pulses200US 5,263,244 AGould Inc. · 1993
- Stacked configuration for integrated circuit devices177US 5,117,282 AHarris Corporation · 1992
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993