Foldable electronic assembly module

An electronic assembly which comprises:

• a flexible, insulating substrate having a network of conductive leads and connecting stations applied thereto;
• at least two substantially quadrangular circuit boards;
• each of said boards laminarly split into substantially symmetric half-sections;
• each of said half-sections having pads on a first face for mounting electronic components;
• each of said half-sections having an opposite second face bonded to said substrate;
• said half-sections laminated together on either side of a portion of the substrate sandwiched therebetween;
• said boards bonded in a side-by-side, parallely spaced-apart configuration;
• a first of said boards having a comb of connecting terminals integral with said first board along a first edge;
• said comb sized and dimensioned to engage a connecting port on a supporting structure;
• a plurality of feed-through connections on each of said boards interconnecting a plurality of said pads and terminals with said connecting stations;
• wherein any gap between two parallely spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap;
• said gap being wide enough to allow for an air space between any opposite facing components attached to separate boards;
• and,
• said gap having no components attached thereto.