Sensor node thermal management and illumination

Abstract

Example embodiments include an apparatus comprising a first printed circuit board (PCB) having an AC-DC power supply thereon and a second PCB having a processor thereon. The first and second BPBs are substantially parallel to one another. A first thermal barrier extends between the first and second PCB. The processor and the power supply are both on a first side of the first thermal barrier. A chamber on a second side of the first thermal barrier opposite the first side. The chamber is at least partly enclosed by a second thermal barrier and has at least one opening for fluid communication with an ambient environment. A temperature sensor is provided in the chamber. In some embodiments, an LED is provided on one of the PCBs, and a light-reflecting silkscreened pattern is provided on the PCB near the LED to increase light output of the apparatus.

Dependencies are inferred from the claim text.