Electronic device interconnection techniques
AssigneeAT&T Corp.
InventorHung N. Nguyen
Life of this patent
Estimating the term…
Abstract
An electronic device (11) has on one surface a first ball grid array (12) having a first area. The first ball grid array is bonded to a first intermediate interconnection member (13) having on an opposite surface a second ball grid array having the same number of solder balls (23) as the first array, but of a significantly larger area than that of the first array. Each of the solder balls (23) of the second ball grid array is connected by a connection comprising a conductive via ( 18, 19) extending through the first interconnection member (13) to one of the solder balls of the first ball grid array.
Claims19
An electronic device package comprising:
- an electronic device having on one surface thereof a first ball grid array of first solder contact elements, the first array having a first area;
- a first intermediate interconnection member having on a first surface thereof a first array of bonding pads each bonded to a first solder contact element, and, on a second surface thereof opposite the first surface, a second ball grid array of second solder contact elements;
- the number of second solder contact elements of the second ball grid array equaling the number of first solder contact elements in the first ball grid array;
- the area of the second ball grid array being significantly larger than the area of the first ball grid array;
- each second solder contact element being connected to a first solder contact element by interconnection means comprising a conductive via extending through the first intermediate interconnection member;
- and each of the second solder contact elements being bonded to one of a second array of bonding pads of a connecting member.
An electronic device package comprising:
- an electronic device having on one surface thereof a first plurality of first contact elements;
- said first contact elements being bonded to a plurality of second contact elements on a first surface of a first insulative member;
- said first insulative member including on a second surface thereof a plurality of third conductive elements;
- each second conductive element being electrically connected to a third conductive element;
- the average distance between adjacent third conductive elements on the second surface being significantly greater than the average distance between adjacent second conductive elements on the first surface;
- and means for electrically connecting each third conductive element to external circuitry.
Dependencies are inferred from the claim text.