H05K 2201/041
Stacked pcbs, i.e. having neither an empty space nor mounted components in
Official title: Stacked PCBs, i.e. having neither an empty space nor mounted components in between
H05K2201/041 (Stacked pcbs, i.e. having neither an empty space nor mounted components in) appears on 425 US grants and 541 published applications in this corpus.
Search patents in H05K- Granted patents
- 425
- Published applications
- 541
- Assignees
- 282
- Inventors
- 1,193
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 4 |
| 2007 | 1 | 4 |
| 2008 | 2 | 5 |
| 2009 | 2 | 6 |
| 2010 | 1 | 6 |
| 2011 | 7 | 9 |
| 2012 | 6 | 6 |
| 2013 | 8 | 13 |
| 2014 | 8 | 20 |
| 2015 | 13 | 25 |
| 2016 | 13 | 27 |
| 2017 | 29 | 42 |
| 2018 | 43 | 50 |
| 2019 | 43 | 47 |
| 2020 | 44 | 48 |
| 2021 | 49 | 41 |
| 2022 | 31 | 45 |
| 2023 | 39 | 41 |
| 2024 | 29 | 43 |
| 2025 | 33 | 34 |
| 2026 | 14 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Memory on package (MOP) with reverse CAMM (compression attached memory module) and CMT connector4 Aug 2026US 12,702,062 B2Intel Corporation
- Circuit board assembly, circuit board stack structure, and electronic device7 Jul 2026US 12,677,373 B2Vivo Mobile Communication Co., Ltd.
- Circuit board having an edge containing conductive regions2 Jun 2026US 12,648,082 B2Teradyne, Inc.
- Drive and control integrated board, control system, and robot2 Jun 2026US 12,648,083 B2Qkm Technology (Dong Guan) Co., Ltd
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Adhesive and method for manufacturing circuit connection structure8 Oct 2026US 2026/0313803 A1
- Higher current surface mount pads and circuit assembly24 Sep 2026US 2026/0292979 A1
- Ball grid array package24 Sep 2026US 2026/0292989 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Touch pad with flexible substrate145US 7,439,962 B2Synaptics Incorporated · 2008
- Free form packaging of specific functions within a computer system91US 5,198,965 AInternational Business Machines Corporation · 1993
- Multi-layer, multi-chip pyramid and circuit board structure90US 5,715,144 AInternational Business Machines Corporation · 1998
- Circuit boards interconnected by overlapping plated through holes portions53US 8,007,286 B1Metrospec Technology, L.L.C. · 2011
- Multi-substrate RF module for wireless communication devices33US 7,348,842 B2Micro Mobio Corporation · 2008