Multi-layer, multi-chip pyramid and circuit board structure

A multi-chip, multi-layer chip pyramidal carrier and circuit board structure comprising;

• I. A multi-chip, multi-layer chip pyramidal carrier comprising:
• a. a first chip carrier formed of a first flexible film of dielectric material having a top surface and bottom surface;
• a plurality of I/C chips disposed on and connected to said top surface of said first flexible film;
• electrical circuitry on said top surface of said first flexible film connected to said I/C chips;
• a plurality of solder balls disposed on said bottom surface of said first flexible film;
• electrically conducting vias extending from said top surface to said bottom surface interconnecting said circuitry on the top surface with at least some of said solder balls on the bottom surface of said first flexible film;
• b. a second chip carrier formed of a second flexible film of dielectric material having a top surface and a bottom surface;
• a plurality of I/C chips and a plurality of pads disposed on said top surface of said second flexible film;
• electrical circuitry on said top surface of said second flexible film connected to said I/C chips and said pads;
• a plurality of solder balls disposed on the bottom surface of said second flexible film;
• electrically conducting vias extending from said top surface to said bottom surface interconnecting said circuitry on the top surface with at least some of said solder balls on the bottom surface of said second flexible film;
• said solder balls of the first chip carrier being electrically and mechanically connected to at least some of said pads on the top surface of the second chip carrier;
• and
• c. a third chip carrier formed of a third flexible film of dielectric material having a top surface and a bottom surface;
• a plurality of I/C chips and a plurality of pads disposed on said top surface of said third flexible film;
• electrical circuitry on said top surface of said third flexible film connected to said I/C chips and said pads;
• a plurality of solder balls disposed on the bottom surface of said third flexible film;
• electrically conducting vias extending from said top surface to said bottom surface interconnecting said circuitry on the top surface with at least some of said solder balls on the bottom surface of said third flexible film;
• said solder balls of the second chip carrier being electrically and mechanically connected to at least some of said pads on the top surface of the third chip carrier;
• and
• II. a circuit board formed of a dielectric material having a top surface with a plurality of pads disposed on said top surface, said solder balls of said third chip carrier being electrically and mechanically joined to said pads on said top surface of said circuit board.