Carrier substrate, a method, and an electronic assembly

An electronic assembly, comprising a first component thermally connected to at least a first side of a carrier substrate, which comprises:

• thermal vias for thermally interconnecting components arranged on at least a first side of the carrier substrate to a heat pipe, wherein the carrier substrate further comprises:
• a first substrate with thermal vias configured to be connected to a first component;
• a second substrate comprising a groove with a heat pipe;
• and
• wherein the first substrate is adhered to the second substrate by an adhesive, wherein the adhesive comprises spacer elements of a predetermined width (d) such that the space between the first substrate and the second substrate is maintained at width (d), such that the heat pipe is embedded in said groove between the first substrate and the second substrate.

A method of producing a carrier substrate comprising thermal vias for thermally interconnecting components arranged on at least a first side of the carrier substrate to a heat pipe, wherein the method comprises the steps of:

• providing a first substrate with thermal vias configured to be connected to a first component;
• providing a second substrate comprising a groove with a heat pipe;
• and
• adhering the first substrate to the second substrate an adhesive, wherein the adhesive comprises spacer elements of a predetermined width (d) such that the space between the first substrate and the second substrate is maintained at width (d), such that the heat pipe is embedded in said groove between the first substrate and the second substrate.