Systems with vertical power distribution network vias and multiple printed circuit board subassemblies

A method, comprising:

• providing a first printed circuit board (PCB) subassembly;
• providing a second PCB subassembly;
• providing an integrated circuit (IC) that is coupled, at least electrically, to at least one of the first PCB subassembly or the second PCB subassembly;
• providing a power module that is coupled, at least electrically, to at least one of the first PCB subassembly or the second PCB subassembly;
• and
• providing a super vertical power distribution network (SV-PDN) via, wherein:
• the SV-PDN via is included in at least one of the first PCB subassembly or the second PCB subassembly;
• the SV-PDN via includes a first power distribution path and a second power distribution path;
• the first power distribution path and the second power distribution path are at least electrically coupled to a same pad;
• and
• the first power distribution path and the second power distribution path are routed with closer via-to-via spacing compared to a first signal path and a second signal path according to a set of via-to-via spacing rules.