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US 7,348,842 B2Granted
Multi-substrate RF module for wireless communication devices
AssigneeMicro Mobio Corporation
InventorsIkuroh Ichitsubo, Guan-Wu Wang, Weiping Wang, Zlatko Aurelio Filipvic
Life of this patent
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Abstract
A radio frequency (RF) module includes a first substrate adapted to receive passive circuits; and a second substrate adapted to receive active circuits, the first and second substrates electrically coupled through pads positioned on opposing surfaces of the first and second substrate.
Claims19
A radio frequency (RF) module, comprising:
- a first substrate to receive passive circuits;
- and
- a second substrate to receive active circuits, the first and second substrates electrically coupled through pads positioned on opposing surfaces of the first and second substrate;
- a printed circuit board (PCB) having pads positioned thereon, the pads being adapted to electrically couple with pads on a remaining surface of the first substrate;
- and
- one or more via holes in the first substrate, and wherein a PCB ground is electrically coupled to the second substrate through the one or more via holes.
3 more elements
A radio frequency (RF) module, comprising:
- a first substrate to receive passive circuits including one or more of:
- a balun, a filter, a diplexer;
- and
- a second substrate to receive active circuits including one or more of a power amplifier, a switch, wherein the first and second substrates are electrically coupled through pads positioned on opposing surfaces of the first and second substrate and wherein the quality signal includes one of:
- Spectral Mask, Adjacent Channel Power Ratio (ACPR), Error Vector Magnitude (EVM), Bit Error Rate (BER), Packet Error Rate (PER).
2 more elements
Dependencies are inferred from the claim text.