Adhesive and method for manufacturing circuit connection structure
OwnerMayumi SATO, Takahiro FUKUI +2inventors
InventorsMayumi SATO, Takahiro FUKUI, Hiroyuki IZAWA, Katsuhiko TOMISAKA
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Abstract
An adhesive that is thermosetting and used in thermocompression bonding of a pair of circuit members via a solder connection material in a method for manufacturing a circuit connection structure including the pair of circuit members electrically connected by solder bonding, having a curing temperature Tc such that a difference (Tc−Tm) from a melting point Tm of the solder connection material is −20° C. or more, and a melt viscosity at the melting point Tm of the solder connection material of 5.0×105 Pa·s or less.
Claims11
An adhesive that is thermosetting and used in thermocompression bonding of a pair of circuit members via a solder connection material in a method for manufacturing a circuit connection structure including the pair of circuit members electrically connected by solder bonding,
- wherein the adhesive has
- a curing temperature Tc such that a difference (Tc−Tm) from a melting point Tm of the solder connection material is −20° C. or more, and
- a melt viscosity at the melting point Tm of the solder connection material of 5.0×105 Pa·s or less.
A method for manufacturing a circuit connection structure using a solder connection material, comprising:
- arranging a pair of circuit members such that electrodes of the pair of circuit members face each other;
- and
- of thermocompression bonding the pair of circuit members arranged to face each other via a thermosetting adhesive,
- wherein the solder connection material is disposed on the electrode of at least one of the pair of circuit members, or the adhesive comprises the solder connection material,
- a difference (Tc−Tm) between a curing temperature Tc of the adhesive and a melting point Tm of the solder connection material is −20° C. or more, and
- a melt viscosity of the adhesive at the melting point Tm of the solder connection material is 5.0×105 Pa·s or less.
Dependencies are inferred from the claim text.