Circuit boards interconnected by overlapping plated through holes portions

An interconnectable circuit board array, comprising:

• a plurality of interconnectable circuit boards, each circuit board comprising
• a distal end having a first electrically conductive pad located on a top of the circuit board;
• a plated through hole located on the conductive pad, the through hole passes through a conductive layer of the circuit board, an insulative layer of the circuit board and a second separate conductive layer of the circuit board, the plated through hole allowing solder to flow from the conductive layer to the second conductive layer;
• a second electrically conductive pad coupled to the plated through hole, the second electrically conductive pad capable of coupling with an electrical component;
• and
• a proximal end having a third electrically conductive pad attached to the top of the circuit board;
• wherein each of the plurality of interconnectable circuit boards includes a portion that overlaps with another interconnectable circuit board to form an overlapping joint and a portion that does not overlap with another interconnectable circuit board.