H05K 2201/043
Stacked pcbs with their backs attached to each other without electrical connection
Official title: Stacked PCBs with their backs attached to each other without electrical connection
H05K2201/043 (Stacked pcbs with their backs attached to each other without electrical connection) appears on 56 US grants and 68 published applications in this corpus.
Search patents in H05K- Granted patents
- 56
- Published applications
- 68
- Assignees
- 56
- Inventors
- 172
- Latest grant
- 6 Aug 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 1 | 4 |
| 2005 | 1 | 4 |
| 2006 | 0 | 2 |
| 2007 | 3 | 4 |
| 2008 | 2 | 8 |
| 2009 | 2 | 8 |
| 2010 | 7 | 2 |
| 2011 | 7 | 7 |
| 2012 | 4 | 2 |
| 2013 | 3 | 1 |
| 2014 | 0 | 1 |
| 2015 | 2 | 6 |
| 2016 | 0 | 1 |
| 2017 | 2 | 3 |
| 2018 | 4 | 3 |
| 2019 | 2 | 2 |
| 2020 | 3 | 4 |
| 2021 | 3 | 0 |
| 2022 | 2 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 2 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and electronic device6 Aug 2024US 12,058,807 B2Boe Technology Group Co., Ltd.
- Thermal solutions for multi-package assemblies and methods for fabricating the same16 May 2023US 11,652,020 B2Intel Corporation
- Circuit board29 Mar 2022US 11,291,123 B2Emot Co., Ltd.
- Cooling module and circuit board22 Mar 2022US 11,284,533 B2Murata Manufacturing Co., Ltd.
- Enclosure with tamper respondent sensor30 Nov 2021US 11,191,154 B2International Business Machines Corporation
- Board-level structure, component, and electronic device21 May 2026US 2026/0143592 A1
- Circuit assembly including gallium nitride devices7 Nov 2024US 2024/0373557 A1Murata Manufacturing Co., Ltd.
- Electronic device and manufacturing method thereof15 Aug 2024US 2024/0274543 A1Innolux Corporation
- Circuit Board and Electronic Device26 Oct 2023US 2023/0345619 A1Boe Technology Group Co., Ltd.
- Microwave wireless charger with focusing of microwave field17 Dec 2020US 2020/0395790 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Stack structure with semiconductor chip embedded in carrier118US 7,321,164 B2Phoenix Precision Technology Corporation · 2008
- Semiconductor device and method of manufacturing the same102US 7,850,087 B2Samsung Electronics Co., Ltd. · 2010
- Thin multi-chip flex module93US 7,796,399 B2Microelectronics Assembly Technologies, Inc. · 2010
- Circuit board unit and method for production thereof52US 7,948,758 B2Agie Charmilles SA · 2011
- Method for producing connection member47US 7,748,110 B2Panasonic Corporation · 2010