Thermal solutions for multi-package assemblies and methods for fabricating the same
AssigneeIntel Corporation
InventorsChia-Pin Chiu, Robert Sankman
Life of this patent
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Abstract
Integrated circuit assemblies, electronic systems, and methods for fabricating the same are disclosed. An integrated circuit assembly is formed by thermally contacting at least two integrated circuit packages to opposite sides of a shared heat dissipation device. In one embodiment, the at least two integrated circuit packages are electrically attached to an electronic card to form an intermediate integrated circuit assembly. In a further embodiment, the integrated circuit assembly includes at least one intermediate integrated circuit assembly electrically attached to an electronic board.
Claims18
An integrated circuit (IC) assembly, comprising first, second, third, and fourth IC packages each comprising an IC device, an electronic substrate, and a heat spreader, wherein a first surface of the IC device is electrically attached to the electronic substrate, and an opposing second surface of the IC device thermally contacts the heat spreader;
- a liquid cooling heat dissipation device having a first surface and an opposing second surface, wherein the heat spreaders of the first and third IC packages are in thermal contact with the first surface of the liquid cooling heat dissipation device and wherein the heat spreaders of the second and fourth IC packages are in thermal contact with the second surface of the liquid cooling heat dissipation device;
- a first securing mechanism comprising first and second plates, wherein the first IC package, the second IC package, and a first portion of the liquid cooling heat dissipation device are between the first and second plates of the first securing mechanism;
- and
- a second securing mechanism comprising first and second plates, wherein the third IC package, the fourth IC package, and a second portion of the liquid cooling heat dissipation device are between the first and second plates of the second securing mechanism, and wherein high surface area projections of the liquid cooling heat dissipation device are between the first and third IC packages and between the second and fourth IC packages.
An electronic system, comprising:
- an integrated circuit (IC) assembly electrically attached to a board, wherein the integrated circuit assembly comprises:
- first, second, third, and fourth IC packages each comprising an IC device, an electronic substrate, and a heat spreader, wherein a first surface of the IC device is electrically attached to the electronic substrate, and an opposing second surface of the IC device thermally contacts the heat spreader;
- a liquid cooling heat dissipation device having a first surface and an opposing second surface, wherein the heat spreaders of the first and third IC packages are in thermal contact with the first surface of the liquid cooling heat dissipation device and wherein the heat spreaders of the second and fourth IC packages are in thermal contact with the second surface of the liquid cooling heat dissipation device;
- a first securing mechanism comprising first and second plates, wherein the first IC package, the second IC package, and a first portion of the liquid cooling heat dissipation device are between the first and second plates of the first securing mechanism;
- and
- a second securing mechanism comprising first and second plates, wherein the third IC package, the fourth IC package, and a second portion of the liquid cooling heat dissipation device are between the first and second plates of the second securing mechanism, and wherein high surface area projections of the liquid cooling heat dissipation device are between the first and third IC packages and between the second and fourth IC packages.
A method for fabricating an integrated circuit assembly, comprising:
- forming first, second, third, and fourth IC packages each comprising an IC device, an electronic substrate, and a heat spreader, wherein a first surface of the IC device is attached to the electronic substrate, and an opposing second surface of the IC device thermally contacts the heat spreader;
- receiving a liquid cooling heat dissipation device having a first surface and an opposing second surface;
- thermally contacting the heat spreader of the first and third IC packages with the first surface of the liquid cooling heat dissipation device and thermally contacting the heat spreader of the second and fourth IC integrated circuit packages with the second surface of the liquid cooling heat dissipation device;
- providing a first securing mechanism comprising first and second plates, wherein the first IC package, the second IC package, and a first portion of the liquid cooling heat dissipation device are between the first and second plates of the first securing mechanism;
- providing a second securing mechanism comprising first and second plates, wherein the third IC package, the fourth IC package, and a second portion of the liquid cooling heat dissipation device are between the first and second plates of the second securing mechanism, and wherein high surface area projections of the liquid cooling heat dissipation device are between the first and third IC packages and between the second and fourth IC packages.
Dependencies are inferred from the claim text.