Back to results
US 7,850,087 B2Granted
Semiconductor device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYi-sung Hwang, Sung-dae Cho
Life of this patent
Estimating the term…
Abstract
A semiconductor device and method of fabricating the same. The semiconductor device includes at least one first contact pin on a first substrate and at least one second contact pin on a second substrate. The at least one first and second contact pins may be included in first and second contact pin arrays. The first and second contact pins of the first and second contact pin arrays may be aligned.
Claims39
A semiconductor device, comprising:
- a first substrate with at least one first contact pin on a first surface;
- at least one semiconductor chip mounted on the first substrate and connected to the at least one contact pin;
- and
- a second substrate with at least one second contact pin on a second surface, the at least one second contact pin connected to at least one of the at least one first contact pin and the at least one semiconductor chip,
- wherein the first and second substrates are printed circuit substrates,
- wherein the second substrate is directly stacked on the first substrate,
- wherein the first substrate includes a first wiring connected to the at least one first contact pin and the second substrate includes a second wiring connected to the at least one second contact pin.
4 more elements
A method of manufacturing a semiconductor device, comprising:
- preparing a first substrate including a plurality of semiconductor chips;
- separating the plurality of semiconductor chips;
- attaching at least one of the separated plurality of semiconductor chips to a second substrate;
- attaching a third substrate to the second substrate;
- and
- electrically connecting the attached at least one separated semiconductor chip to at least one of the second and third substrates.
3 more elements
A memory card, comprising:
- at least one substrate having a first contact pin array on a first surface of the memory card and a second contact pin array on a second surface of the memory card, at least a portion of the first and second contact pin arrays being aligned and electronically connected to each other,
- wherein the at least one substrate includes a first substrate and a second substrate,
- wherein the first and second substrates are printed circuit substrates,
- wherein the second substrate is directly stacked on the first substrate.
1 more element
Dependencies are inferred from the claim text.