Board-level structure, component, and electronic device

Abstract

This application provides a board-level structure, a component, and an electronic device. The board-level structure includes a second substrate and at least one first component. The first component includes a first body and a first substrate, a first solder joint and a second solder joint are disposed on the first substrate, and the first substrate is connected to the first body through the first solder joint. An accommodation portion and a third solder joint are disposed on the second substrate, the third solder joint is located on the second substrate and is close to the accommodation portion, the first substrate is soldered to the second substrate through the second solder joint and the third solder joint, the first substrate is bridged above the accommodation portion, and at least a part of the first body extends into the accommodation portion.

Dependencies are inferred from the claim text.