H05K 2201/049
Pcb for one component
Official title: PCB for one component, e.g. for mounting onto mother PCB
H05K2201/049 (Pcb for one component) appears on 572 US grants and 518 published applications in this corpus.
Search patents in H05K- Granted patents
- 572
- Published applications
- 518
- Assignees
- 311
- Inventors
- 1,242
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 8 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 17 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 9 | 0 |
| 2000 | 14 | 0 |
| 2001 | 22 | 8 |
| 2002 | 23 | 28 |
| 2003 | 24 | 25 |
| 2004 | 22 | 25 |
| 2005 | 18 | 16 |
| 2006 | 15 | 24 |
| 2007 | 11 | 29 |
| 2008 | 14 | 20 |
| 2009 | 10 | 23 |
| 2010 | 19 | 22 |
| 2011 | 18 | 13 |
| 2012 | 9 | 12 |
| 2013 | 12 | 15 |
| 2014 | 8 | 22 |
| 2015 | 16 | 16 |
| 2016 | 13 | 18 |
| 2017 | 18 | 19 |
| 2018 | 15 | 28 |
| 2019 | 34 | 24 |
| 2020 | 19 | 28 |
| 2021 | 27 | 26 |
| 2022 | 21 | 24 |
| 2023 | 20 | 17 |
| 2024 | 20 | 17 |
| 2025 | 17 | 12 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sensor interposer employing castellated through-vias30 Jun 2026US 12,672,235 B2DexCom, Inc.
- Display module and electronic device including the same12 May 2026US 12,628,278 B2Samsung Electronics Co., Ltd.
- Electronic circuit device having closed-core inductors in side-by-side relation and associated methods5 May 2026US 12,621,934 B2Harris Global Communications, Inc.
- LED electrical contact for 3D LEDs14 Apr 2026US 12,604,772 B2Lumileds Singapore Pte. Ltd.
- Capacitor and electronic device comprising same31 Mar 2026US 12,592,337 B2Samsung Electronics Co., Ltd.
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
- Printed circuit board module2 Jul 2026US 2026/0190234 A1Canon Kabushiki Kaisha
- Power module4 Jun 2026US 2026/0157196 A1Shinko Electric Industries Co., Ltd.
- Component Carrier With Protruding Thermal Structure and Manufacture Method30 Apr 2026US 2026/0123409 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method of manufacturing circuit board23 Apr 2026US 2026/0113852 A1Alps Alpine Co., Ltd.
Most cited
By later US patents
- Stacked semiconductor device323US 7,049,692 B2Fujitsu Limited · 2006
- Electronic device interconnection techniques286US 5,477,933 AAT&T Corp. · 1995
- Low profile multi-IC chip package connector218US 6,258,623 B1Micron Technology, Inc. · 2001
- Methods for assembling multiple semiconductor devices202US 7,198,980 B2Micron Technology, Inc. · 2007
- Flexible connectors for microelectronic elements192US 6,086,386 ATessera, Inc. · 2000