Low profile multi-IC chip package connector
AssigneeMicron Technology, Inc.
InventorsWalter L. Moden, Jerrold L. King, Jerry M. Brooks
Life of this patent
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Abstract
A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with busses formed on one side. In another embodiment, the connector comprises multiple busses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with busses within the cage, or, alternatively, are directly fixed to leads or pads on the host circuit board.
Claims7
A method for connecting outer leads of a stacked plurality of primary integrated circuit packages, comprising:
- providing a substrate having a plurality of circuits thereon;
- providing a semicontinuous tape of flexible non-conductive polymeric material having a width configured to encompass the outer leads of said stacked plurality of primary integrated circuit packages;
- forming a plurality of spaced transverse conductive buses on said non-conductive polymeric material, each of said plurality of spaced transverse conductive buses configured to have one end connectable to an electrically conductive pad of said substrate;
- and
- connecting said plurality spaced transverse of conductive busses to said outer leads of said stacked plurality of primary integrated circuit packages and to said plurality of circuits of said substrate.
Dependencies are inferred from the claim text.