Component Carrier With Protruding Thermal Structure and Manufacture Method
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorJeesoo MOK
Life of this patent
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Abstract
A component carrier includes i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) an electronic component embedded in the stack; and iii) a thermal structure, configured to dissipate thermal energy produced by the electronic component towards and beyond a main surface of the stack. The thermal structure includes iiia) a base structure mounted on and/or at least partially embedded in the stack, in particular flush with one of the layer structures of the stack, and iiib) a plurality of protrusions, protruding from the base structure, and extending beyond the main surface of the stack.
Claims16
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure,
- an electronic component embedded in the stack;
- and
- a thermal structure, configured to dissipate thermal energy produced by the electronic component towards and beyond a main surface of the stack, wherein the thermal structure includes
- a base structure mounted on and/or at least partially embedded in the stack, and
- a plurality of protrusions, protruding from the base structure, and extending beyond the main surface of the stack.
A method for manufacturing a component carrier, the method comprising:
- forming a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure,
- embedding an electronic component in the stack;
- and
- forming a thermal structure, so that the thermal structure dissipates thermal energy produced by the electronic component towards a main surface of the stack,
- wherein the thermal layer structure comprises a base structure mounted on and/or at least partially embedded in the stack, and a plurality of protrusions, protruding from the base structure, and extending beyond the main surface of the stack.
A semi-finished product, comprising:
- a high temperature resistant layer;
- and
- a photo-imageable dielectric (PID) layer structure on top of the high temperature resistant layer.
Dependencies are inferred from the claim text.