Method of manufacturing circuit board
AssigneeAlps Alpine Co., Ltd.
InventorKatsuhiko KISHIDA
Life of this patent
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Abstract
A method of manufacturing a circuit board is disclosed. The method includes: a first step of forming a plurality of pixel circuits on a film with the pixels connected to each other by a wiring pattern; a second step of processing the film to thin the film at least at a position between pixels, and singulating the film into individual pixel units such that the film is cut together with the wiring pattern at the position between the pixels; a third step of transferring a plurality of singulated pieces, each having a pixel circuit formed thereon, onto a flexible substrate; and a fourth step of forming a stretchable interconnect by depositing liquid metal between wiring patterns cut in the second step.
Claims6
A method of manufacturing a circuit board, the method comprising:
- a first step of forming a plurality of pixel circuits on a film with the pixels connected to each other by a wiring pattern;
- a second step of processing the film to thin the film at least at a position between pixels, and singulating the film into individual pixel units such that the film is cut together with the wiring pattern at the position between the pixels;
- a third step of transferring a plurality of singulated pieces, each having a pixel circuit formed thereon, onto a flexible substrate;
- and
- a fourth step of forming a stretchable interconnect by depositing liquid metal between wiring patterns cut in the second step.
Dependencies are inferred from the claim text.