Sensor interposer employing castellated through-vias

A method of manufacturing a wearable biosensor, the method comprising:

• providing a sensor interposer comprising:
• a planar substrate,
• a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via formed in the planar substrate,
• a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via formed in the planar substrate, the second castellated through-via electrically isolated from the first castellated through-via, and
• a sensor physically coupled to the planar substrate, the sensor comprising at least two electrodes, a first electrode of the at least two electrodes electrically coupled to the first electrical contact, and a second electrode of the at least two electrodes electrically coupled to the second electrical contact, and
• a sensor chemical disposed on a distal end of the sensor;
• and
• providing a printed circuit board (“PCB”) having a plurality of electrical contacts defined on a first surface of the PCB;
• and
• wherein the sensor interposer is physically coupled to the first surface of the PCB, and wherein the first and second castellated through-vias are electrically and physically coupled to a respective first and second electrical contacts of the plurality of electrical contacts defined on the first surface of the PCB.