Multichip module for surface mounting on printed circuit boards
AssigneeSiemens Aktiengesellschaft
InventorsVassilios Kalivas, Alois Nitsch, Heinz Peters
Life of this patent
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Abstract
A ceramic substrate secured with a flexible adhesive to a first side of a printed circuit board that belongs to a module and has circuit structures is provided. The ceramic substrate is contacted to the circuit structures with bond connections. The terminal elements are formed by approximately spherical accumulations of solder attached on the backside of the printed circuit board, these solder accumulations being connected to the circuit structures on the first side of the printed circuit board via through-contactings.
Claims15
A multi-chip printed circuit board module for surface mounting on a main printed circuit board having electronic components fixed on a substrate selected from a group consisting of thin-film and thick film, and having SMD-compatible terminal elements, said multichip module comprising:
- a ceramic substrate secured with a flexible adhesive to a first side of the printed circuit board module;
- a plurality of circuit structures located on said printed circuit board module and connected to said ceramic substrate with bond connections;
- and
- a plurality of terminal elements formed by approximately spherical accumulations of solder applied on a backside of said printed circuit board module, said plurality of terminal elements being connected via through-contactings to said plurality of circuit structures on said first side of said printed circuit board module, said plurality of terminal elements for electrically connecting the printed circuit board module to the main printed circuit board.
Multichip module for surface mounting on a printed circuit board having electronic components fixed on a substrate selected from a group consisting of thin-film and thick film, and having SMD-compatible terminal elements, said multichip module comprising:
- a ceramic substrate secured with a flexible adhesive to a first side of a printed circuit board of said module;
- a plurality of circuit structures contacted to said ceramic substrate with bond connections;
- a plurality of terminal elements formed by approximately spherical accumulations of solder applied on a backside of said printed circuit board, said plurality of terminal elements being connected via through-contactings to said plurality of circuit structures on said first side of said printed circuit board;
- and
- a protective cap to cover said module on said first side so that said module can be processed in an automated manner, said protective cap having a reinforcing frame filled by soft gel casting compound and a snap-on cover attached thereon.
Multichip module for surface mounting on a printed circuit board having electronic components fixed on a substrate selected from a group consisting of thin-film and thick film, and having SMD-compatible terminal elements, said multichip module comprising:
- a ceramic substrate secured with a flexible adhesive to a first side of a printed circuit board of said module;
- a plurality of circuit structures contacted to said ceramic substrate with bond connections;
- a plurality of terminal elements formed by approximately spherical accumulations of solder applied on a backside of said printed circuit board, said plurality of terminal elements being connected via through-contactings to said plurality of circuit structures on said first side of said printed circuit board;
- and
- a protective cap to cover said module on said first side so that said module can be processed in an automated manner, said protective cap having a grid-shaped reinforcing frame filled by soft gel casting compound and a snap-on cover attached thereon.
Dependencies are inferred from the claim text.