H05K 2201/045
Hierarchy auxiliary pcb, i.e. more than two levels of hierarchy for daughter
Official title: Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
H05K2201/045 (Hierarchy auxiliary pcb, i.e. more than two levels of hierarchy for daughter) appears on 126 US grants and 135 published applications in this corpus.
Search patents in H05K- Granted patents
- 126
- Published applications
- 135
- Assignees
- 99
- Inventors
- 406
- Latest grant
- 29 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 0 |
| 2002 | 5 | 8 |
| 2003 | 4 | 10 |
| 2004 | 7 | 6 |
| 2005 | 3 | 8 |
| 2006 | 9 | 14 |
| 2007 | 8 | 8 |
| 2008 | 6 | 10 |
| 2009 | 5 | 8 |
| 2010 | 6 | 4 |
| 2011 | 6 | 4 |
| 2012 | 3 | 0 |
| 2013 | 5 | 3 |
| 2014 | 0 | 1 |
| 2015 | 4 | 4 |
| 2016 | 0 | 3 |
| 2017 | 4 | 4 |
| 2018 | 5 | 5 |
| 2019 | 2 | 0 |
| 2020 | 2 | 4 |
| 2021 | 7 | 11 |
| 2022 | 5 | 1 |
| 2023 | 3 | 4 |
| 2024 | 2 | 7 |
| 2025 | 3 | 7 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board assembly and radio unit comprising the same29 Jul 2025US 12,376,233 B2Telefonaktiebolaget LM Ericsson (publ)
- Circuit and connector element alignment, circuit board assemblies22 Jul 2025US 12,369,253 B2Infineon Technologies Austria AG
- Integrated antenna-in-package structure28 Jan 2025US 12,211,773 B2JCET STATS ChipPAC Korea Limited
- Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof16 Jul 2024US 12,040,281 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Power module and power device13 Feb 2024US 11,901,108 B2Delta Electronics (Shanghai) Co., Ltd.
- Vertical Cage Daughterboard for Vertical Pluggable Modules27 Aug 2026US 2026/0255486 A1Ciena Corporation
- Electronic circuit board18 Dec 2025US 2025/0386426 A1Hitachi Vantara, Ltd.
- Expansion card module18 Sep 2025US 2025/0294666 A1Asus Global Pte. Ltd.
- Electronic connectors for use on board a spacecraft19 Jun 2025US 2025/0202144 A1Airbus Defence and Space GmbH
- Electronic circuit module19 Jun 2025US 2025/0204076 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Stacked semiconductor device323US 7,049,692 B2Fujitsu Limited · 2006
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000
- Methods for assembling multiple semiconductor devices202US 7,198,980 B2Micron Technology, Inc. · 2007
- Semiconductor device assemblies and packages including multiple semiconductor devices and methods145US 6,906,415 B2Micron Technology, Inc. · 2005
- Optoelectronic transmitter with improved control circuit and laser fault latching103US 6,160,647 AStratos Lightwave, Inc. · 2000