Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof

A manufacturing method of a semiconductor package, comprising:

• providing a rigid-flexible substrate, wherein the rigid-flexible substrate comprises rigid structures, a rigid frame and a flexible core, the rigid structures are laterally spaced apart from one another, the rigid frame laterally surrounds the rigid structures and separates from the rigid structures, the flexible core laterally penetrates through the rigid structures and extends to the rigid frame to connect the rigid frame with the rigid structures, the flexible core has first segments and second segments intersected with the first segments, an array of openings are enclosed by the first and second segments, and the rigid structures are each positioned at an intersection of one of the first segments and one of the second segments;
• and
• bonding a package structure onto the rigid-flexible substrate, wherein the package structure comprises semiconductor dies and an encapsulant laterally surrounding the semiconductor dies.