Integrated antenna-in-package structure
AssigneeJCET STATS ChipPAC Korea Limited
InventorsSeungHyun Lee, HeeSoo Lee
Life of this patent
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Abstract
A semiconductor device includes a first substrate. An electrical component is disposed over the first substrate. A board-to-board connector is disposed over the first substrate. An encapsulant is deposited over the first substrate and electrical component to form a subpackage. The board-to-board connector remains exposed from the encapsulant. A contact pad is formed on a side surface of the subpackage. The subpackage is mounted to an antenna through the contact pad.
Claims25
A semiconductor device, comprising:
- a first substrate;
- an electrical component disposed over the first substrate;
- a board-to-board connector disposed over the first substrate;
- an encapsulant deposited over the first substrate and electrical component to form a subpackage, wherein the board-to-board connector remains exposed from the encapsulant;
- a contact pad formed on a side surface of the subpackage;
- and
- an antenna mounted to the subpackage by a solder bump extending from the contact pad to the antenna.
A semiconductor device, comprising:
- a first substrate including a board-to-board connector mounted to the first substrate;
- an antenna including a second substrate mounted to the first substrate;
- and
- a solder bump extending from the first substrate to the second substrate.
A method of making a semiconductor device, comprising:
- providing a first substrate;
- disposing an electrical component over the first substrate;
- disposing a board-to-board connector over the first substrate;
- depositing an encapsulant over the first substrate and electrical component to form a subpackage, wherein the board-to-board connector remains exposed from the encapsulant;
- forming a contact pad on a side surface of the subpackage;
- providing an antenna;
- and
- mounting the subpackage to the antenna through a solder bump reflowed between the contact pad and antenna.
A method of making a semiconductor device, comprising:
- providing a first substrate including a board-to-board connector mounted to the first substrate;
- providing an antenna including a second substrate;
- and
- mounting the first substrate to the second substrate by reflowing a solder bump between the first substrate and second substrate.
Dependencies are inferred from the claim text.