Semiconductor device assemblies and packages including multiple semiconductor devices and methods

A semiconductor device assembly, comprising:

• an interposer including a first surface, a second surface opposite the first surface, and at least one receptacle extending from the first surface to the second surface;
• a first semiconductor device positioned at least partially over the first surface and including an active surface, at least a portion of the active surfaca facing the at least one receptacle;
• at least one first discrete conductive element electrically connecting a bond pad of the first semiconductor device and a corresponding contact pad at the first surface of the interposer that is in substantial alignment with the bond pad;
• a second semiconductor device positioned at least partially over to the second surface and including an active surface, at least a portion of which faces the at least one receptacle;
• and
• at least one second discrete conductive element electrically connecting a bond pad of the second semiconductor device and a corresponding bond pad of the first semiconductor device through the at least one receptacle.

A multidie semiconductor device package, comprising:

• an interposer, comprising:
• a substrate with first and second surfaces;
• a receptacle extending between the first and second surfaces;
• and
• bond pad carried by at least the first surface;
• at least one first-level semiconductor device positioned within the receptacle, a backside of the at least one first-level semiconductor device being substantially coplanar with the second surface of the interposer or located between the first and second surfaces of the interposer, each first-level semiconductor device also having an active surface;
• a second-level semiconductor device positioned over the first surface of the interposer and attached thereto, the second-level semiconductor device having an active surface;
• at least one intermediate conductive element extending at least partially laterally between a bond pad of the at least one first-level semiconductor device and a corresponding bond pad carried by the first surface of the substrate of the interposer, the at least one intermediate conductive element being bonded to at least the corresponding bond pad;
• and
• electrical connections connecting the second-level semiconductor device to corresponding bond pads of the interposer.