H05K 2201/047
Box-like arrangements of pcbs
Official title: Box-like arrangements of PCBs
H05K2201/047 (Box-like arrangements of pcbs) appears on 110 US grants and 134 published applications in this corpus.
Search patents in H05K- Granted patents
- 110
- Published applications
- 134
- Assignees
- 118
- Inventors
- 348
- Latest grant
- 25 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 1 | 3 |
| 2010 | 0 | 5 |
| 2011 | 3 | 2 |
| 2012 | 4 | 5 |
| 2013 | 4 | 8 |
| 2014 | 4 | 13 |
| 2015 | 8 | 11 |
| 2016 | 8 | 4 |
| 2017 | 10 | 12 |
| 2018 | 4 | 8 |
| 2019 | 9 | 6 |
| 2020 | 8 | 10 |
| 2021 | 10 | 10 |
| 2022 | 10 | 9 |
| 2023 | 2 | 10 |
| 2024 | 9 | 9 |
| 2025 | 13 | 6 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic component module and power supply device comprising same25 Nov 2025US 12,484,153 B2LG Innotek Co., Ltd.
- Structural locating sensors for a sensor module using a printed circuit board assembly14 Oct 2025US 12,442,701 B2BRP Megatech Industries Inc.
- Drive with segmented inverter housing14 Oct 2025US 12,445,020 B2Innomotics GmbH
- Power supply cooling structure7 Oct 2025US 12,439,543 B2AA Power Inc.
- Thermal-type flow sensor with a thermally conductive frame element in the form of a printed circuit board (PCB)26 Aug 2025US 12,399,049 B2Berkin B.V.
- Board, board assembly method, and communication device23 Apr 2026US 2026/0113847 A1Huawei Technologies Co., Ltd.
- Rectifier module27 Nov 2025US 2025/0364918 A1Delta Electronics (Shanghai) Co., Ltd.
- Three dimensional circuit module and method for manufacturing the same13 Nov 2025US 2025/0351271 A1Silergy Semiconductor Technology (Hangzhou) LTD
- Package for multiple loudspeakers16 Oct 2025US 2025/0320114 A1STMicroelectronics International N. V.
- Three dimensional circuit mounting structures6 Feb 2025US 2025/0048532 A1NVIDIA Corporation
Most cited
By later US patents
- Robotic surgical system with local sensing of functional parameters based on measurements of multiple physical inputs249US 11,376,082 B2Cilag GmbH International · 2022
- Instrument drive units235US 10,736,219 B2Covidien LP · 2020
- Printed circuit boards as insulated components for a time of flight mass spectrometer54US 6,316,768 B1Leco Corporation · 2001
- Package for rugged electronics37US 4,513,064 AThe United States of America as represented by the Secretary of the Army · 1985
- Ion trap mass analyzer33US 7,498,569 B2Fudan University · 2009