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US 2025/0048532 A1Published application
Three dimensional circuit mounting structures
AssigneeNVIDIA Corporation
InventorsJoey Cai, Tiger Yan, Zhu Hao, Yi Dinghai
Life of this patent
Estimating the term…
Abstract
A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.
Claims21
A circuit board comprising:
- a plurality of chip die mounted on a three-dimensional rectangular structure;
- and
- a ball grid array for the chip die interposed between the three-dimensional rectangular structure and the circuit board.
A circuit board comprising:
- a plurality of chip die mounted on two or more sides of a three-dimensional rectangular structure;
- a ball grid array for the chip die interposed between the three-dimensional rectangular structure and the circuit board;
- and
- a heat sink covering two or more continuous sides of the three-dimensional rectangular structure.
1 more element
A circuit board manufacturing process comprising:
- mounting a plurality of chip die on a three-dimensional rectangular structure;
- and
- interposing a ball grid array for the chip die between the three-dimensional rectangular structure and the circuit board.
Dependencies are inferred from the claim text.