Power supply cooling structure
AssigneeAA Power Inc.
InventorQun Lu
Life of this patent
Estimating the term…
Abstract
An apparatus includes a case, a first printed circuit board (PCB) and a second PCB within the case. The case includes a top portion and a bottom portion opposite to each other. The first PCB has a first surface and a second surface opposite to each other, and is attached to the top portion of the case via the second surface of the first PCB. At least one heat-generating device is mounted on the first surface of the first PCB. The second PCB has a first surface and a second surface opposite to each other, and is attached to the bottom portion of the case via the second surface of the second PCB. At least one heat-generating device is mounted on the first surface of the second PCB. The apparatus may include more PCBs. An inner shell may be provided forming an air duct within the case.
Claims20
An apparatus comprising:
- a first case comprising a top portion and a bottom portion opposite to each other;
- a first circuit board within the first case, the first circuit board having a first surface and a second surface opposite to each other, and the first circuit board attached to the top portion of the first case via the second surface of the first circuit board, with at least one first heat-generating device mounted on the first surface of the first circuit board;
- a first thermal pad disposed between the first circuit board and the top portion of the first case;
- and
- a second circuit board within the first case, the second circuit board having a first surface and a second surface opposite to each other, and the second circuit board attached to the bottom portion of the first case via the second surface of the second circuit board, with at least one second heat-generating device mounted on the first surface of the second circuit board;
- and
- a first thermally conductive potting adhesive layer disposed between the first thermal pad and the first circuit board.
An apparatus comprising:
- a first case comprising a top portion and a bottom portion opposite to each other;
- a first printed circuit board (PCB) within the first case, the first PCB having a first surface and a second surface opposite to each other, the first PCB attached to the top portion of the first case via the second surface of the first PCB, and at least one first heat-generating device mounted on the first surface of the first PCB;
- a first thermal pad disposed between the first PCB and the top portion of the first case;
- a second PCB within the first case, the second PCB having a first surface and a second surface opposite to each other, the second PCB attached to the bottom portion of the first case via the second surface of the second PCB, and at least one second heat-generating device mounted on the first surface of the second PCB;
- a third PCB within the first case, the third PCB being connected between the first PCB and the second PCB along a first sidewall of the first case;
- and
- a fourth PCB within the first case, the fourth PCB being connected between the first PCB and the second PCB along a second sidewall of the first case, and the third PCB and the fourth PCB opposite to each other;
- a first thermally conductive potting adhesive layer disposed between the first thermal pad and the first PCB.
Dependencies are inferred from the claim text.