Three dimensional circuit module and method for manufacturing the same
AssigneeSilergy Semiconductor Technology (Hangzhou) LTD
InventorsGao Fan, Chen Zhao
Life of this patent
Estimating the term…
Abstract
A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.
Claims16
A method of making a three dimensional circuit module, the method comprising:
- a) providing a first mold having an outer shell, an inner core, and at least one crevice formed between the outer shell and the inner core, wherein the crevice comprises a connected first gap and at least one second gap that are located on different extension surfaces;
- b) filling dielectric material into at least one crevice;
- and
- c) removing the first mold after the dielectric material is solidified to obtain a first circuit assembly, wherein the first circuit assembly comprises a first main board and at least one first side board that are located on different faces.
A method of making a three dimensional circuit module, the method comprising:
- a) providing a second mold having a first extension surface and at least one second extension surface connected with the first extension surface;
- b) depositing multilayer metal on the first extension surface and at least one second extension surface of the second mold;
- and
- c) performing structural trimming and shaping treatment on the multilayer metal to obtain the first circuit assembly.
Dependencies are inferred from the claim text.