H05K 2201/06
Thermal details
H05K2201/06 (Thermal details) appears on 2,483 US grants and 2,957 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,483
- Published applications
- 2,957
- Assignees
- 1,094
- Inventors
- 6,399
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 10 | 0 |
| 1986 | 3 | 0 |
| 1987 | 7 | 0 |
| 1988 | 8 | 0 |
| 1989 | 22 | 0 |
| 1990 | 16 | 0 |
| 1991 | 10 | 0 |
| 1992 | 17 | 0 |
| 1993 | 14 | 0 |
| 1994 | 18 | 0 |
| 1995 | 16 | 0 |
| 1996 | 14 | 0 |
| 1997 | 21 | 0 |
| 1998 | 42 | 0 |
| 1999 | 31 | 0 |
| 2000 | 34 | 0 |
| 2001 | 55 | 14 |
| 2002 | 36 | 52 |
| 2003 | 37 | 42 |
| 2004 | 38 | 48 |
| 2005 | 28 | 74 |
| 2006 | 47 | 89 |
| 2007 | 52 | 78 |
| 2008 | 41 | 84 |
| 2009 | 46 | 80 |
| 2010 | 54 | 68 |
| 2011 | 56 | 73 |
| 2012 | 63 | 45 |
| 2013 | 42 | 61 |
| 2014 | 45 | 86 |
| 2015 | 68 | 138 |
| 2016 | 86 | 121 |
| 2017 | 123 | 147 |
| 2018 | 136 | 230 |
| 2019 | 191 | 193 |
| 2020 | 169 | 202 |
| 2021 | 173 | 159 |
| 2022 | 146 | 164 |
| 2023 | 138 | 144 |
| 2024 | 119 | 147 |
| 2025 | 121 | 173 |
| 2026 | 79 | 245 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Electrical equipment22 Sep 2026US 12,745,351 B2Valeo Electrification
- Heat dissipating assembly for circuit15 Sep 2026US 12,739,964 B2Schneider Electric (China) Co., Ltd.
- Structural enclosure for protection against foreign object debris and restraint of thermal interface material15 Sep 2026US 12,739,978 B2Raytheon Company
- Use of inorganic thin non-woven dielectrics in printed circuit boards8 Sep 2026US 12,733,093 B2Advanced Chip and Circuit Materials, Inc.
- Enhanced thermal management in high-power electronics using phase change materials8 Oct 2026US 2026/0313780 A1Connaught Electronics Ltd.
- Microfluidic printed circuit board cooling8 Oct 2026US 2026/0313782 A1Microsoft Technology Licensing, LLC
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Fastening system for an electronic circuit board1 Oct 2026US 2026/0298449 A1BEGA Gantenbrink-Leuchten KG
- Systems and methods for leakage protection1 Oct 2026US 2026/0299655 A1Quanta Computer Inc.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- BGA component masking dam and a method of manufacturing with the BGA component masking dam353US 11,172,580 B2Rosemount Aerospace Inc. · 2021
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999