Structural enclosure for protection against foreign object debris and restraint of thermal interface material

A method comprising:

• obtaining an electrical component mounted to a substrate;
• attaching a structural enclosure to the substrate such that the structural enclosure is positioned around lateral edges of the electrical component, the structural enclosure comprising raised walls extending away from the substrate and surrounding the electrical component, the raised walls configured to block foreign object debris from the electrical component;
• placing a thermal interface material over the electrical component;
• placing a seal over the structural enclosure;
• and
• connecting a lid to the substrate, the lid covering the electrical component and the structural enclosure, the seal being compressed when the lid is connected to the substrate;
• wherein the electrical component comprises a semiconductor die and a ball grid array;
• wherein the substrate comprises a printed circuit board;
• wherein the ball grid array is surface-mounted to a surface of the printed circuit board;
• and
• wherein the structural enclosure is attached to the surface of the printed circuit board.

An apparatus comprising:

• a structural enclosure configured to be mounted to a substrate and positioned around lateral edges of an electrical component mounted to the substrate;
• wherein the structural enclosure comprises raised walls configured to surround the electrical component, the raised walls configured to block foreign object debris from the electrical component;
• wherein the raised walls comprise or are configured to cooperate with a groove configured to receive a portion of a seal;
• and
• wherein each of the raised walls has a non-uniform thickness such that an upper portion of each raised wall is thicker than a lower portion of the raised wall.