H05K 2201/066
Heatsink mounted on the surface of the printed circuit board [pcb]
Official title: Heatsink mounted on the surface of the printed circuit board [PCB]
H05K2201/066 (Heatsink mounted on the surface of the printed circuit board [pcb]) appears on 1,010 US grants and 1,254 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,010
- Published applications
- 1,254
- Assignees
- 562
- Inventors
- 2,722
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 8 | 0 |
| 1998 | 8 | 0 |
| 1999 | 11 | 0 |
| 2000 | 11 | 0 |
| 2001 | 8 | 2 |
| 2002 | 8 | 8 |
| 2003 | 4 | 5 |
| 2004 | 6 | 11 |
| 2005 | 9 | 14 |
| 2006 | 5 | 20 |
| 2007 | 11 | 12 |
| 2008 | 8 | 14 |
| 2009 | 11 | 11 |
| 2010 | 6 | 11 |
| 2011 | 9 | 19 |
| 2012 | 10 | 9 |
| 2013 | 4 | 13 |
| 2014 | 14 | 30 |
| 2015 | 23 | 62 |
| 2016 | 37 | 57 |
| 2017 | 53 | 68 |
| 2018 | 75 | 164 |
| 2019 | 112 | 117 |
| 2020 | 116 | 114 |
| 2021 | 101 | 96 |
| 2022 | 78 | 75 |
| 2023 | 76 | 72 |
| 2024 | 59 | 83 |
| 2025 | 60 | 86 |
| 2026 | 41 | 81 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Electronic assembly and semiconductor switching device18 Aug 2026US 12,713,514 B2Siemens Aktiengesellschaft
- Enhanced thermal management in high-power electronics using phase change materials8 Oct 2026US 2026/0313780 A1Connaught Electronics Ltd.
- Fastening system for an electronic circuit board1 Oct 2026US 2026/0298449 A1BEGA Gantenbrink-Leuchten KG
- Fixing structure for electronic module and electronic module1 Oct 2026US 2026/0304595 A1Shindengen Electric Manufacturing Co., Ltd.
- Wiring substrate24 Sep 2026US 2026/0292965 A1Niterra Co., Ltd.
- Semiconductor device, semiconductor module, power conversion unit, and method for manufacturing semiconductor device17 Sep 2026US 2026/0280165 A1Rohm Co., Ltd.
Most cited
By later US patents
- Multi-chip integrated circuit module178US 5,432,677 ATexas Instruments Incorporated · 1995
- Packaging power converters128US 5,973,923 A1999
- Multi-chip integrated circuit module and method for fabrication thereof119US 5,306,670 ATexas Instruments Incorporated · 1994
- Illumination apparatus and method115US 7,241,030 B2Avago Technologies ECBU IP (Singapore) Pte. Ltd. · 2007
- Dissipation of heat through keyboard using a heat pipe114US 5,513,070 AIntel Corporation · 1996