Heat dissipating assembly for circuit
AssigneeSchneider Electric (China) Co., Ltd.
InventorsZhibao Wang, Baoyun Bi, Xiaoqiang Li
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AssigneeSchneider Electric (China) Co., Ltd.
InventorsZhibao Wang, Baoyun Bi, Xiaoqiang Li
Estimating the term…
Embodiments of the present disclosure provides a heat dissipating assembly for a circuit, the circuit comprises a printed circuit board and a plurality of electronic components, the printed circuit board is provided with a plurality of first through holes for pins of the plurality of electronic components to pass through, the heat dissipating assembly comprises: a bracket connected to the printed circuit board, the bracket is provided with a second through hole for a respective pin to pass through at a position corresponding to each first through hole; a plurality of heat dissipating sheets each disposed against a pair of electronic components of the plurality of electronic components; and a plurality of limiting members each disposed adjacent to a side of the bracket away from the printed circuit board, to limit each pair of electronic components and a respective heat dissipating sheet to a predetermined position relative to the bracket.
A heat dissipating assembly for a circuit, the circuit comprises a printed circuit board and a plurality of electronic components, the printed circuit board is provided with a plurality of first through holes for pins of the plurality of electronic components to pass through, wherein the heat dissipating assembly comprises:
A heat dissipating assembly for a circuit, the circuit comprises a printed circuit board and a plurality of electronic components, the printed circuit board is provided with a plurality of first through holes for pins of the plurality of electronic components to pass through, wherein the heat dissipating assembly comprises:
A heat dissipating assembly for a circuit, the circuit comprises a printed circuit board and a plurality of electronic components, the printed circuit board is provided with a plurality of first through holes for pins of the plurality of electronic components to pass through, wherein the heat dissipating assembly comprises:
Dependencies are inferred from the claim text.