Semiconductor device, semiconductor module, power conversion unit, and method for manufacturing semiconductor device
AssigneeRohm Co., Ltd.
InventorsTomohiro YASUNISHI, Takayuki ISHIHARA, Hideki SAWADA
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Abstract
A semiconductor device includes a semiconductor element, a plurality of connecting parts each being conductive, a sealing part that covers the semiconductor element and a portion of each of the connecting parts, a plurality of signal terminals each inserted into one of the connecting parts, and a holding part. The signal terminals protrude from the sealing part toward a first side in a thickness direction of the sealing part. The holding part covers a portion of each signal terminal. In one example, the signal terminals are collectively held and inserted into the connecting parts.
Claims18
A semiconductor device comprising:
- a semiconductor element;
- a plurality of connecting parts each being conductive;
- a sealing part that covers the semiconductor element and a portion of each of the plurality of connecting parts;
- a plurality of signal terminals each inserted into one of the plurality of connecting parts;
- and a holding part,
- wherein the plurality of signal terminals protrude from the sealing part toward a first side in a thickness direction of the sealing part, and
- the holding part covers a portion of each of the plurality of signal terminals.
A method for manufacturing a semiconductor device including a semiconductor element, a plurality of connecting parts each being conductive, a sealing part covering the semiconductor element and a portion of each of the plurality of connecting parts, and a plurality of signal terminals protruding from the sealing part toward one side with respect to the sealing part,
- the method comprising inserting the plurality of signal terminals into the plurality of connecting parts while collectively holding the plurality of signal terminals.
Dependencies are inferred from the claim text.